View HLMP-AM64-24BDD_7908415.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

hlmp-ag64/65, hlmp-am64/65, hlmp-ab64/65 precision optical performance red green and blue new 5mm mini oval leds data sheet caution: ingan devices are class 1c hbm esd sensitive per jedec standard. please observe appropriate precautions during handling and processing. refer to application note an C 1142 for additional details. description these precision optical performance oval leds are spe - cifcally designed for full color/video and passenger infor - mation signs. the oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide feld of view outdoor applications where a wide viewing angle and readability in sunlight are essential. the package epoxy contains both uv-a and uv-b inhibi - tors to reduce the efects of long term exposure to direct sunlight. features ? well defned spatial radiation pattern ? high brightness material ? available in red, green and blue color red alingap 626 nm green ingan 525nm blue ingan 470nm ? superior resistance to moisture ? standof package ? tinted and difused ? typical viewing angle 30 x 70 applications ? full color signs package dimensions package drawing a package drawing b notes: all dimensions in millimeters (inches). tolerance is 0.20mm unless other specifed measure at base of lens 5.2 0.20 0.205 0.008 8.70 0.20 0.342 0.008 2.54 0.3 0.100 0.012 1.0 0.038 3.80 0.20 0.150 0.008 min. 0.8 0.032 max. epoxy meniscus cathode lead 24.00 0.945 min. 0.50 0.10 0.020 0.004 1.50 0.15 0.0591 0.006 11.70 0.50 0.4606 0.02 sq typ measured at base of lens 5.20 0.20 0.205 0.008 8.70 0.20 0.342 0.008 2.54 0.3 0.100 0.012 1.0 0.038 3.80 0.20 0.150 0.008 min. 0.8 0.016 max. epoxy meniscus cathode lead 24.00 0.945 min. 0.50 0.10 0.020 0.004 sq typ
2 device selection guide part number color and dominant wavelength l d (nm) typ luminous intensity iv (mcd) at 20 ma-min luminous intensity iv (mcd) at 20 ma-max standof package drawing hlmp-ag64-x10xx red 626 1660 3500 no a hlmp-ag65-x10xx red 626 1660 3500 yes b hlmp-am64-140xx green 525 2900 6050 no a hlmp-am65-140xx green 525 2900 6050 yes b hlmp-ab64-tw0xx blue 470 800 1660 no a hlmp-ab65-tw0xx blue 470 800 1660 yes b tolerance for each intensity limit is 15%. notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package. part numbering system note: please refer to ab 5337 for complete information about part numbering system. packaging option dd: ammopack zz: flexi ammopack color bin selection 0: open distribution maximum intensity bin 0: no maximum intensity limit minimum intensity bin refer to device selection guide. standoff/ non standoff 4: non standoff 5: standoff color g: red 626 m: green 525 b: blue 470 package a: 5mm mini oval 30 x 70 h l m p - a x 6 x ? x x x x x
3 absolute maximum ratings t a = 25c parameter red green and blue unit dc forward current [1] 50 30 ma peak forward current 100 [2] 100 [3] ma power dissipation 120 116 mw reverse voltage 5 (i r = 100 a) 5 (i r = 10 a) v led junction temperature 130 110 c operating temperature range -40 to +100 -40 to +85 c storage temperature range -40 to +100 -40 to +100 c notes: 1. derate linearly as shown in figure 4 and figure 8 2. duty factor 30%, frequency 1khz. 3. duty factor 10%, frequency 1khz. electrical / optical characteristics t a = 25c parameter symbol min. typ. max. units test conditions forward voltage red green blue v f 1.8 2.8 2.8 2.1 3.2 3.2 2.4 3.8 3.8 v i f = 20 ma reverse voltage red green & blue v r 5 5 v i f = 100 a i f = 10 a dominant wavelength [1] red green blue l d 618 520 460 626 525 470 630 540 480 nm i f = 20 ma peak wavelength red green blue l peak 634 516 464 nm peak of wavelength of spectral distribution at i f = 20 ma thermal resistance r q j-pin 240 c/w led junction-to-pin luminous efcacy [2] red green blue h v 150 530 65 lm/w emitted luminous power/ emitted radiant power notes: 1. the dominant wavelength is derived from the chromaticity diagram and represents the color of the lamp 2. the radiant intensity, ie in watts per steradian, may be found from the equation ie = i v / h v where i v is the luminous intensity in candelas and h v is the luminous efcacy in lumens/watt.
4 0 10 20 30 40 50 0 0.5 1 1.5 2 2.5 forward voltage - v forward current - ma 0 0.5 1 1.5 2 2.5 0 10 20 30 40 50 dc forward current - ma relative luminous intensity (normalized at 20 ma) 0 10 20 30 40 50 60 0 20 40 60 80 100 t a - ambient tempera ture - - c i f ma x . - ma ximum forw ard current - ma 0 0.2 0.4 0.6 0.8 1 550 600 650 700 wavelength - nm relative intensity alingap red figure 1. relative intensity vs wavelength figure 2. forward current vs forward voltage figure 3. relative intensity vs forward current figure 4. maximum forward current vs ambient temperature
5 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 3 8 0 4 3 0 4 8 0 5 3 0 5 8 0 6 3 0 wavelength - nm relative intensity green blue 0 5 10 15 20 25 30 0 1 2 3 4 forward voltage -v forward current - ma 0 0 . 2 0 . 4 0 . 6 0 . 8 1 1 . 2 1 . 4 1 . 6 0 5 1 0 1 5 2 0 2 5 3 0 3 5 dc forward current - ma relative luminous intensity green b l u e 0 5 10 15 20 25 30 35 0 2 0 4 0 6 0 8 0 1 0 0 t a - ambienttemperature - c i f max - maximum forward current - ma (normalize at 20 ma) -4 -2 0 2 4 6 8 10 12 14 16 0 5 1 0 1 5 2 0 2 5 3 0 3 5 green forward current - ma dominant wavelenght shift - nm blue ingan blue and green figure 5. relative intensity vs wavelength figure 6. forward current vs forward voltage figure 7. relative intensity vs forward current figure 8. maximum forward current vs ambient temperature figure 9. relative dominant wavelength vs forward current
6 figure 10. radiation pattern-major axis figure 11. radiation pattern-minor axis 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -90 -60 -30 0 30 60 90 angular displacement-degree normalized intensity 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -90 -60 -30 0 30 60 90 angular displacement - degree normalized intensity green blue red green blue red
7 green color bin table bin min dom max dom xmin ymin xmax ymax 1 520.0 524.0 0.0743 0.8338 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 2 524.0 528.0 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 3 528.0 532.0 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 4 532.0 536.0 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 5 536.0 540.0 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 tolerance for each bin limit is 0.5nm. blue color bin table bin min dom max dom xmin ymin xmax ymax 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 2 464.0 468.0 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 3 468.0 472.0 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 4 472.0 476.0 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 5 476.0 480.0 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 tolerance for each bin limit is 0.5nm note: 1. all bin categories are established for classifcation of products. products may not be available in all bin categories. please contact your avago representative for further information. intensity bin limit table (1.2: 1 iv bin ratio) bin intensity (mcd) at 20 ma min max t 800 960 u 960 1150 v 1150 1380 w 1380 1660 x 1660 1990 y 1990 2400 z 2400 2900 1 2900 3500 2 3500 4200 3 4200 5040 4 5040 6050 tolerance for each bin limit is 15% vf bin table (v at 20ma) bin id min max vd 1.8 2.0 va 2.0 2.2 vb 2.2 2.4 notes: 1. tolerance for each bin limit is 0.05v 2. vf binning only applicable to red color. red color range min dom max dom xmin ymin xmax ymax 618 630 0.6872 0.3126 0.6890 0.2943 0.6690 0.3149 0.7080 0.2920 tolerance for each bin limit is 0.5nm
8 relative light output vs junction temperature avago color bin on cie 1931 chromaticity diagram t j - junction temperature - c relative light output (normalized at t j = 25 c) 0.1 1 10 -40 -20 0 20 40 60 80 100 120 140 red blue green 4 green 5 4 3 2 1 red blue 5 3 2 1 0.000 0.200 0.400 0.600 0.800 1.000 0.000 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.800 x y
9 precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. ? for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. ? if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. soldering and handling: ? care must be taken during pcb assembly and soldering process to prevent damage to the led component. ? led component may be efectively hand soldered to pcb. however, it is only recommended under unavoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led using soldering iron tip closer than 1.59mm might damage the led. ? esd precaution must be properly applied on the soldering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. ? recommended soldering condition: wave soldering [1, 2] manual solder dipping pre-heat temperature 105 c max. - preheat time 60 sec max - peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max note: 1) above conditions refers to measurement with thermocouple mounted at the bottom of pcb. 2) it is recommended to use only bottom preheaters in order to reduce thermal stress experienced by led. ? wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. customer is advised to perform daily check on the soldering profle to ensure that it is always conforming to recommended soldering conditions. note: 1. pcb with diferent size and design (component density) will have diferent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering profle again before loading a new type of pcb. 2. avago technologies allngap high brightness led are using high efciency led die with single wire bond as shown below. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250c and the solder contact time does not exceeding 3sec. over-stressing the led during soldering process might cause premature failure to the led due to delamination. avago technologies led confguration note: electrical connection between bottom surface of led die and the lead frame is achieved through conductive paste. ? any alignment fxture that is being applied during wave soldering should be loosely ftted and should not apply weight or force on led. non metal material is recommended as it will absorb less heat during wave soldering process. note: in order to further assist customer in designing jig accurately that ft avago technologies product, 3d model of the product is available upon request. ? at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment fxture or pallet. ? if pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be soldered using refow soldering prior to insertion the th led. ? recommended pc board plated through holes (pth) size for led component leads. led component lead size diagonal plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) ? over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause difculty inserting the th led. refer to application note 5334 for more information about soldering and handling of high brightness th led lamps. 1.59mm alingap device cathode ingan device andoe
10 example of wave soldering temperature profle for th led 0 30 40 90 100 250 200 150 100 50 time (minutes) preheat turbulent wave laminar wave hot air knife recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin flux solder bath temperature: 245 c 5 c (maximum peak temperature = 250 c) dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) note: allow for board to be sufficiently cooled to room temperature before exerting temperature ( c) 10 20 70 60 50 80 mechanical force. ammo packs drawing 6.35 1.30 0.250 0.051 9.125 0.625 0.3595 0.0245 18.00 0.50 0.7085 0.0195 12.70 0.30 0.500 0.012 20.5 1.00 0.8070 0.0394 12.70 1.00 0.500 0.039 cathode view a - a 0.70 0.20 0.276 0.0075 4.00 0.20 0.1575 0.0075 typ. note: all dimensions in millimeters (inches)
11 packaging label (i) avago mother label: (available on packaging box of ammo pack and shipping box) ( 1 p ) i t e m : p a r t n u m b e r (1t) lot: lot number lpn: (9d)mfg date: manufacturing date ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: refer to below information (9d) date code: date code s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c (1p) part # : part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: refer to below information datecode: date code r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y label packaging box for ammo packs note: for ingan device, the ammo pack packaging box contain esd logo label on this side of box from left side of box adhesive tape must be facing upwards. anode lead leaves the box first.
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2009 avago technologies. all rights reserved. av02-1510en - february 13, 2009 acronyms and defnition: bin: (i) color bin only or vf bin only (applicable for part number with color bins but without vf bin or part number with vf bins and no color bin) or (ii) color bin incorporated with vf bin (applicable for part number that have both color bin and vf bin) (ii) avago baby label (only available on bulk packaging) example: (i) color bin only or vf bin only bin: 2 (represent color bin 2 only) bin: vb (represent vf bin vb only) (ii) color bin incorporate with vf bin disclaimer: avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or appli - cations. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. bin: 2vb vb: vf bin ? vb ? 2: c olor bin 2 only ( 1 p ) i t e m : p a r t n u m b e r (1t) lot: lot number lpn: (9d)mfg date: manufacturing date ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: refer to below information (9d) date code: date code s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c (1p) part # : part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: refer to below information datecode: date code r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y label

▲Up To Search▲

Price & Availability of HLMP-AM64-24BDD

	To Download HLMP-AM64-24BDD Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .